| Lapisan | 1-2 Lapisan |
| Ketebalan Selesai | 16-134 juta (0.4mm-3.4mm ) |
| Maks. Dimensi | 500mm *1200mm |
| Ketebalan Tembaga | 35um, 70um,1 hingga 10oZ |
| Lebar Garisan Min/Ruang | 4 juta (0.1mm) |
| Minimum Saiz Lubang Selesai | 0.95mm |
| Min. Saiz Gerudi | 1.00mm |
| Maks. Saiz Gerudi | 6.5mm |
| Toleransi Saiz Lubang Selesai | ±0.050mm |
| Ketepatan Kedudukan Apertur | ±0.076mm |
| Min Saiz PAD SMT | 0.4mm±0.1mm |
| Min.Solder Mask PAD | 0.05mm(2 juta) |
| Min.Solder Mask Cover | 0.05mm(2 juta) |
| Topeng pateri Ketebalan | >12um |
| Kemasan Permukaan | HAL, HAL Tanpa plumbum, OSP, Emas Rendaman, dsb |
| Ketebalan HAL | 5-12um |
| Ketebalan Emas Rendaman | 1-3 juta |
| Ketebalan Filem OSP | ENTEK PLUS HT:0.3-0.5um; F2: 0.15-0.3um |
| Penamat Garis Besar | Penghalaan & Penebuk; Sisihan Kepersisan ±0.10mm |
| Kekonduksian Terma | 1.0 hingga 12w/mk |
| Pelabuhan FOB | Shenzhen |
| Eksport Karton Dimensi L/W/H | 36 x 26 x 25 Sentimeter |
| Masa Utama | 3–7 hari |
| Unit setiap Kadbod Eksport | 5.0 |
| Berat Karton Eksport | 18 Kilogram |